Ag Sintering Paste for Die-attach

Features of Ag Sintering Paste

High bonding strength by metal sintering with nano Ag and micron Ag powders

・Low electrical resistance
・High thermal conductivity
・Unique resin dispersion system for achieving high heat resistance and reliability with low stress (exhibits high bonding reliability even at 250°C)

Comparison with Conventional Ag Paste

The bonding process of Ag sintering paste

・Utilization of existing equipment is possible
　Pressure-less bonding
　Same application method as conventional Ag paste
・Apply low temperature 200-250°C for sintering
・Curing in air or nitrogen atmosphere

Applications of silver sintering paste

【For Solder Replacement】
・Substitution for high-temperature lead solder
・Substitution for AuSn solder

【Devices】
・SiC/GaN power devices (TO packages, power modules)
・Vertical-cavity surface-emitting lasers (VCSEL)br>・High-power LEDs

Cross-Sectional Observation of the Sintering Layer

Bonding Reliability Test (Comparison with various soldering methods)

Thermal Resistance Change by Thermal Cycle Test (-55°C/150°C)

Test conditions（Data provided by the customer）
PKG：HQFP
Die：6.0x6.0x0.4mm (BM:Au)
LF： Ag-plated Cu LF
Pre-condition： MSL1 (260°C/10s, 3 times)

Shear Strength Change (at 250°C high-temperature exposure)

Test conditions（In-house testing）
Die：4.0x4.0x0.3mm (BM:Au)
LF：Pd-PPF
Measurement temperature：260°C